Vacuum Reflow System "VADU Series: 100/200/300"
A void-free vacuum reflow system that achieves high reliability and reproducibility! Offering a wide range of applications for power semiconductor products.
The "VADU series" is a vacuum reflow system equipped with a soldering zone featuring a vacuum chamber and a cooling zone. It allows for reduction using formic gas and is compatible with flux-containing solder paste and preforms. The configuration of the equipment can be selected according to the application, product size, and production scale. ■ VADU100 is a system suitable for small-scale production and research applications in laboratories. ■ VADU200 is a batch-type mass production device capable of processing 300mm wafers. ■ VADU300 is an inline device that can accommodate large-scale mass production. Additionally, various custom modifications can be made based on product and process conditions. 【Features】 ■ Void-free solder connections ■ Compatible with preforms and solder paste ■ Flux management (separation and recovery function) ■ Reduction using formic gas is possible ■ Independent soldering profiles ■ Soldering temperatures up to 400°C (up to 500°C as an option) ■ Auto-clamp mechanism (automatic product holding function) ■ Control of heating rates and cooling rates *For more details, please download the PDF or feel free to contact us.
- Company：Advanced Global Alliance K.K.
- Price：Other
